The University of Maryland Develops Graduate Certificate in Engineering Program in Electronic Packaging for Professional Engineers

The Clark School of Engineering has created a new graduate level program for professional engineers that will provide the knowledge, skills and abilities involved in the reliable integration and packaging of electronics.

“As we continue to grow our professional graduate programs, it is important to us to address the needs of the engineering community, and electronic packaging engineering is an area that is under-served,” says George Syrmos, Executive Director of the Office of Advanced Engineering Education that oversees the program. “We intend this to be an evolving program that will continue to offer expertise on the latest developments in this rapidly changing and critically important field.”

The new Graduate Certificate in Engineering program complements the academic options the Clark School currently offers in electrical engineering, mechanical engineering and materials science as well as the research work being done in the Department of Mechanical Engineering and the Center for Advanced Life Cycle Engineering (CALCE).

Electronics are increasingly embedded in advanced technologies like health monitors, smartphones, electronic cars, wind turbines and more. This widespread incorporation has been largely driven by advanced integration and packaging technologies which govern the weight, manufacturability, quality and reliability of products. Packaging techniques are often as important as device performance to the critical success of projects, creating a growing need for professional engineers with expertise in this niche area.

Course topics include the basics of electronic system integration, heat transfer, thermal management, stress analysis, quality and reliability assessment and more. Classes are offered outside business hours and online, allowing working professionals to maintain full-time positions while completing this part-time program. Learn more at http://advancedengineering.umd.edu/packaging.

Published January 30, 2017