(301)-405-5471
Sukrut Prashant Phansalkar was a Graduate Research Assistant at the CALCE and interned at Intel Corporation during the summer of 2021. His research is focused on mechanical characterization and numerical modeling of polymers used in advanced electronics packaging technologies like FO-WLP, heterogeneous integration, etc.
Sukrut Prashant Phansalkar completed his Ph.D. in Mechanical Engineering in August 2024, working in the LOMSS lab under the guidance of Professor Bongtae Han. He earned his Ph.D. with a dissertation titled "Mold Process Induced Residual Stress Prediction using Cure Extent Dependent Viscoelastic Behavior."
He also holds a Master of Technology (MTech) in Thermal Engineering from the Indian Institute of Technology, Kharagpur, in 2018. Additionally, Sukrut earned his Bachelor of Technology (BTech) in Mechanical Engineering from the same institution in 2018.
Some of his Publications:
Transitioning from Warpage "Control" to Warpage "Design": A Paradigm Shift, Sukrut Prashant Phansalkar, Bongtae Han, and Gun Lee, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 4, pp. 743-746, April 2024, DOI: doi.org/10.1109/TCPMT.2024.3382133.
Deterministic Approach to Obtain Autocatalytic Cure Kinetics Model Constants by Normal Equations of Least-Squares Method, Sukrut Prashant Phansalkar and Bongtae Han, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 4, pp. 743-746, April 2024, DOI: doi.org/10.1109/TCPMT.2024.3382133.
Time-dependent Bulk Behavior of Cured Epoxy Molding Compound, Sukrut Prashant Phansalkar, Roshith Mittakolu, and Bongtae Han, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 2093-2100, DOI: 10.1109/ECTC51909.2023.00358.
Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, Ran Tao, Sukrut Prashant Phansalkar, Aaron M. Forster, and Bongtae Han, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1319-1326, DOI: 10.1109/ECTC51909.2023.00225.
On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA), Sukrut Prashant Phansalkar, Bongtae Han, Ehsan Akbari, and Paulius Vaitiekunas, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Garden Grove, California, USA. October 25-27, 2022. V001T05A004. ASME. DOI: 10.1115/IPACK2022-97719
Top